Texas Instruments

Tech News Roundup
ICYMI: Embedded Insights Episode 8 - Video
March 14, 2025Hello Embedded Engineers, Developers and Makers! Welcome to In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.
Embedded Computing Design Unveils Dev Kit Zone at embedded world 2025 - Blog
March 06, 2025Embedded Computing Design is excited to reveal that its all new Dev Kit Zone will make its debut at embedded world 2025 in Nuremburg, Germany, March 11 to 13.
CES 2025: Embedded Editor Roundup Report - Story
February 03, 2025It’s only about a month out from CES and we’re already seeing the impacts of some of the news that was dropped in Las Vegas at the biggest show in consumer electronics.
TI Introduces New Magnetic Packaging Technology for Power Modules - News
July 24, 2024DALLAS -- Texas Instruments (TI) introduced six new power modules designed to improve power density, enhance efficiency, and reduce EMI. These power modules leverage TI's proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23% to support industrial, enterprise, and communications application designers.
COMPUTEX 2024 & Robotics AI and Sensing with Texas Instruments - Podcast
June 13, 2024On this episode of Embedded Insiders, Senior Technology Editor, Ken, and Errol Leon, System Engineering & Marketing Manager of Robotics at Texas Instruments (TI) discuss the work of robotics in collaboration with humans and the role of motor control, board-to-board communication and sensor fusion in the future of robotics.
But first, Rich and Ken recap a recent trip to Taipei for COMPUTEX 2024.
TI Introduces Industry's First GaN IPM Solution for High-Voltage Motors - News
June 11, 2024DALLAS -- Texas Instruments (TI) introduced the industry's first 650V three-phase GaN IPM for 250W motor drive applications. The new GaN IPM addresses the design and performance compromises in major home appliances and heating, ventilation, and air-conditioning (HVAC) systems.
TI to Showcase Technologies for a Safer, Smarter and More Sustainable Future at embedded world 2024 - News
April 05, 2024DALLAS, March 13, 2024 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today announced that it will demonstrate new embedded processing and connectivity products for enabling a safer, smarter and more sustainable future at embedded world, April 9 through 11 in Nuremberg, Germany. TI's exhibit in hall 3A, booth 131 will showcase the latest advancements in application areas such as robotics, energy transition and electric vehicles.