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Tech News Roundup

ICYMI: Embedded Insights Episode 8 - Video

March 14, 2025

Hello Embedded Engineers, Developers and Makers! Welcome to In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.

Open Source
Tech News Roundup

CES 2025: Embedded Editor Roundup Report - Story

February 03, 2025

It’s only about a month out from CES and we’re already seeing the impacts of some of the news that was dropped in Las Vegas at the biggest show in consumer electronics.

Analog & Power

TI Introduces New Magnetic Packaging Technology for Power Modules - News

July 24, 2024

DALLAS -- Texas Instruments (TI) introduced six new power modules designed to improve power density, enhance efficiency, and reduce EMI. These power modules leverage TI's proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23% to support industrial, enterprise, and communications application designers. 

Industrial

COMPUTEX 2024 & Robotics AI and Sensing with Texas Instruments - Podcast

June 13, 2024

On this episode of Embedded Insiders, Senior Technology Editor, Ken, and Errol Leon, System Engineering & Marketing Manager of Robotics at Texas Instruments (TI) discuss the work of robotics in collaboration with humans and the role of motor control, board-to-board communication and sensor fusion in the future of robotics.

But first, Rich and Ken recap a recent trip to Taipei for COMPUTEX 2024.

Industrial

TI Introduces Industry's First GaN IPM Solution for High-Voltage Motors - News

June 11, 2024

DALLAS -- Texas Instruments (TI) introduced the industry's first 650V three-phase GaN IPM for 250W motor drive applications. The new GaN IPM addresses the design and performance compromises in major home appliances and heating, ventilation, and air-conditioning (HVAC) systems.

Industrial

TI to Showcase Technologies for a Safer, Smarter and More Sustainable Future at embedded world 2024 - News

April 05, 2024

DALLAS, March 13, 2024 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today announced that it will demonstrate new embedded processing and connectivity products for enabling a safer, smarter and more sustainable future at embedded world, April 9 through 11 in Nuremberg, Germany. TI's exhibit in hall 3A, booth 131 will showcase the latest advancements in application areas such as robotics, energy transition and electric vehicles.